iSIM
ApplicationIntegrated SIM -- SIM functionality built directly into a device SoC, eliminating the need for a separate chip.
iSIM
An iSIMiSIMApplicationSIMSIMApplicationSmart card for mobile network authentication.Click to view → integrated into device SoC.Click to view → (Integrated SIM) is a SIM implementation where the subscriber identity module functionality is built directly into a device's main system-on-chip (SoC), eliminating the need for a separate physical SIM card or even a discrete eSIM chip. The SIM application runs in a hardware-isolated secure partition within the SoC, achieving Secure Element grade protection while dramatically reducing the component count, board space, and cost per connected device.
iSIM Architecture
The iSIM integrates three traditionally separate components into one SoC:
| Traditional Component | iSIM Equivalent |
|---|---|
| Separate eSIM chip (MFF2) | Hardware-isolated secure enclave in the SoC |
| Baseband modem | Integrated modem on the same die |
| Application processor | Shares the SoC silicon |
The secure partition is enforced by hardware mechanisms — dedicated security logic, isolated memory regions, and a separate boot path that prevents the application processor from accessing SIM credentials. This is fundamentally different from a TEE, which relies on processor mode switching; the iSIM partition has its own cryptographic engine and tamper-detection circuits embedded in the SoC silicon.
iSIM vs eSIM vs Physical SIM
| Attribute | Physical SIM | eSIM | iSIM |
|---|---|---|---|
| Separate chip | Yes (removable) | Yes (soldered) | No (in SoC) |
| Board area | 50-120 mm2 (tray+card) | 30 mm2 (MFF2) | 0 mm2 (integrated) |
| Unit cost addition | $0.50-$2.00 | $0.30-$1.00 | ~$0.05 marginal |
| CC certification | Chip-level | Chip-level | SoC secure partition |
| Remote provisioning | No (physical swap) | Yes (RSP) | Yes (RSPRSPApplicationOver-the-air SIM profile management.Click to view →) |
| Target market | Consumer mobile | Consumer + IoT | Massive IoT |
Use Cases
iSIM is designed for massive IoT deployments where cost, size, and power consumption per device must be minimized:
- Smart meters: Cellular-connected utility meters in the millions
- Asset trackers: Small GPS/LTE trackers for logistics
- Wearables: Compact devices where SIM tray or MFF2 space is unavailable
- Industrial sensors: Connected factory equipment with 10+ year lifecycles
Provisioning
iSIM uses the same GSMA Remote SIM Provisioning (RSP) infrastructure as eSIMeSIMApplicationProgrammable embedded SIM chip.Click to view →. The LPA (Local Profile Assistant) on the device communicates with the SM-DP+ server to download and activate operator profiles. Because the iSIM partition supports the same eUICCeUICCProvisioningReprogrammable SIM chip supporting remote profile switching.Click to view → interfaces as a discrete eSIM chip, existing RSP infrastructure works without modification.
Industry Status
Qualcomm's Snapdragon platforms and Samsung's Exynos modem SoCs have demonstrated iSIM capability. The GSMA's iSIM specification (based on SGP.22 consumer RSP) provides the standards framework, and GSMA SAS certification has been extended to cover SoC-integrated secure partitions.
Related Content
Smart Card Form Factors Explained
Getting Started…be post-loaded over the air. eSIM — Embedded SIM (SGP.22 / iSIM) The eSIM replaces a removable SIM with a soldered chip on…
SIM Card Types Explained
Getting Started…2012 0.67 mm eSIM (MFF2) Embedded 6.0 × 5.0 mm 2016 0.8 mm iSIM Integrated Die-level 2018 N/A *Micro-SIM was standardised…
TEE vs Secure Element
Security…separate, dedicated security chip (or die partition in an iSIM SoC) with its own CPU, RAM, and non-volatile storage. The…
eSIM and Remote SIM Provisioning
Industry Applications…packages from SM-DP+ to device. The SIM Toolkit and iSIM architectures influence how the LPA surfaces profile…
Smart Card in IoT
Industry Applications…inside application SoC Consumer wearables, smart home iSIM SE + modem in single package Miniaturised IoT, wearables…
SIM to eSIM Migration Guide
Industry Applications…6 × 5 mm (soldered) IoT / no tray 2016 No physical swap iSIM Integrated in SoC Wearables 2018 Zero footprint The iSIM…
5G SIM and iSIM Technology
Industry Applications5G SIM and iSIM Technology The evolution from 4G LTE to 5G introduces a…
Sıkça Sorulan Sorular
The smart card glossary is a comprehensive reference of technical terms, acronyms, and concepts used in smart card technology. It covers protocols (APDU, T=0, T=1), security (Common Criteria, EAL, HSM), hardware (SE, EEPROM, contact pad), and applications (EMV, ePassport, eSIM). It serves developers, product managers, and engineers.
Yes. SmartCardFYI provides glossary definitions in 15 languages including English, Korean, Japanese, Chinese, Spanish, Portuguese, Hindi, Arabic, French, Russian, German, Turkish, Vietnamese, Indonesian, and Thai.