MFF2 (eSIM Package)

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Machine-to-machine form factor (6 x 5 x 0.8 mm) for soldered eSIM chips.






  
  

    
    




    
    

    
    

      
Specifications

      

        

          
            
            
Dimensions6 x 5 x 0.8

            
            
            
ISO StandardJEDEC MO-311

            
          
        

      

    


    
    

    
    
    
    

      
Card Types

      

        
        
          

            
eSIM (eUICC)

            Embedded
          

          
Embedded SIM with remote provisioning capability, enabling multiple carrier profiles on a soldered chip.

        
        
      

    

    
    

    
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