MFF2 (eSIM Package)

Machine-to-machine form factor (6 x 5 x 0.8 mm) for soldered eSIM chips.

사양

치수6 x 5 x 0.8
ISO 표준JEDEC MO-311

카드 유형

eSIM (eUICC)

Embedded

Embedded SIM with remote provisioning capability, enabling multiple carrier profiles on a soldered chip.