MFF2 (eSIM Package)

Machine-to-machine form factor (6 x 5 x 0.8 mm) for soldered eSIM chips.

规格

尺寸6 x 5 x 0.8
ISO标准JEDEC MO-311

卡片类型

eSIM (eUICC)

Embedded

Embedded SIM with remote provisioning capability, enabling multiple carrier profiles on a soldered chip.